a. Pain Points: Wafers are vulnerable to vibration, scratches, and electrostatic discharge, which reduce yield rates. b. Material: Anti-static EPE inner tray + EPP fixing frame. c. Core Benefits: Custom slots perfectly fit mainstream wafer sizes, enabling rapid static dissipation, zero displacement during drops, and a clean, dust-free environment, significantly improving yield rates. d. Application Scenarios: Long-distance wafer transport boxes, clean room turnover, stepper wafer transport buffers. e. Image: Actual shot of EPE wafer inner tray + EPP fixing frame assembly.

a. Pain Points: Chip storage is prone to moisture, scratches, and chemical contamination. b. Material: Anti-static EPE composite film + custom EPO parts. c. Core Benefits: Moisture-proof, scratch-resistant, chemical corrosion-resistant, and free of volatile pollutants, suitable for long-term storage. d. Application Scenarios: Chip finished product packaging, semiconductor sensor transport, precision integrated circuit protection. e. Image: Actual shot of custom EPO inner tray for chips.

a. Pain Points: Precision equipment is expensive, vulnerable to collision damage, and has high operating energy consumption. b. Material: Cleanroom-grade EPP + EPO composite. c. Core Benefits: EPP absorbs impact and is clean and dust-free; EPO adapts to complex curved surfaces, significantly reducing weight compared to traditional metal parts and lowering energy consumption. d. Application Scenarios: Lithography machine body protection, etching machine corner protection, inspection equipment shell protection. e. Image: Schematic diagram of EPP anti-collision strip installation for lithography machines.

a. Pain Points: Vibration during equipment operation affects process accuracy and causes positioning deviation. b. Material: High-resilience EPP. c. Core Benefits: Effectively attenuates vibration, improves wafer processing yield, and ensures anti-slip stability with zero displacement. d. Application Scenarios: Vibration-damping feet for lithography machines, ion implanters, and inspection equipment. e. Image: Close-up shot of EPP vibration-damping feet for semiconductor equipment.

a. Pain Points: High-temperature heat transfer damages components; low-temperature process conditions are unstable. b. Material: Flame-retardant grade MPPE + EPS thermal insulation layer. c. Core Benefits: MPPE withstands 110∘C high temperatures with flame-retardant insulation. EPS maintains low-temperature stability, ensuring process accuracy. d. Application Scenarios: Annealing furnace protection, thermal insulation for low-temperature plasma etchers, liners for high-temperature packaging testing areas. e. Image: Actual shot of MPPE protective parts for annealing furnaces.

a. Pain points: fixture volatile contamination, test probe damage chip b. Material selection: EPO jig liner + EPE buffer c. Core benefits: EPO is clean, low-volatile, and resistant to chemical corrosion;EPE buffer prevents probe crush and anti-static electricity d. Adaptation scenarios: chip packaging fixture, test bench liner, probe card protection e. Drawing: Real shot picture of the EPO liner of the packaging test fixture

a. Pain Points: Handling tools generate dust and static electricity, contaminating the cleanroom environment. b. Material: Cleanroom-grade EPP trays + EPO dividers. c. Core Benefits: EPP is dust-free, non-shedding, and autoclavable; EPO is easy to clean, chemical-resistant, and perfectly adapted to cleanroom requirements. d. Application Scenarios: Cleanroom wafer trays, component storage racks, handling robot tray liners. e. Image: Actual shot of EPP handling trays in cleanroom.

a. Pain Points: Electrical control equipment short circuits, wire abrasion, and contamination generation. b. Material: MPPE insulators + EPE wire protection. c. Core Benefits: MPPE provides excellent insulation and is clean and dust-free; EPE is flexible, scratch-resistant, and anti-static, ideal for cleanroom wiring. d. Application Scenarios: Cleanroom electrical cabinets, equipment wiring, vacuum equipment protection parts. e. Image: Disassembly diagram of MPPE insulators in electrical control cabinets.